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2.4KW 60000rpm Wafer Cutting Machine For PCB

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2.4KW 60000rpm Wafer Cutting Machine For PCB

Brand Name : YUSHUNLI

Model Number : SDS1000

Certification : CE

Place of Origin : China Dongguan

MOQ : 1set

Price : USD1000~40000

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 200Sets/Month

Delivery Time : 5-7work days

Packaging Details : plywooden case

cutting speed : 0.05 ~ 400mm/sec

resolution : 0.0001mm

Repeat positioning accuracy : 0.001 / 310mm

Angle of rotation : 360 deg

speed : 5,000 ~ 60,000rpm

power supply : 3P , 220 (50 ~ 60 Hz)V

machine power : 4KW

Power air pressure : 0.5 ~ 0.6 MPa

Air consumption : 200 L/min

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2.4 KW Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
•Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm)
•Repeat positioning accuracy : 0.001mm
•Cutting speed: 0.05 ~ 400 mm/sec
•Standard collocation of using blade size:2 Inch (Max:3 Inch)
• CCD automatic align.
• Real-time monitoring system of air pressure, water pressure,current, etc., to avoid damage to the air spindle.
x-axis
Working stroke
340MM
cutting speed
0.05 ~ 400mm/sec

resolution
0.0001MM

y-axis
Working stroke
 310MM
resolution
0.0001MM
Repeat positioning accuracy
0.001 / 310MM

z-axis
Working stroke
60 (2 InchBlade)mm
resolution
0.0001mm

Θ-axis
Angle of rotation
 360deg
Specifications:
Dimensions of processing
Φ300mm
Dimensions of working platform
Φ350mm
power
 2.4KW
speed
5,000 ~ 60,000 rpm
power supply
3P , 220 (50 ~ 60 Hz)v
Power air pressure
0.5 ~ 0.6 MPa
Air consumption
 200L/min
Cutting water consumption
 4.0L/min
cooling water consumption
 1.5L/min
(W×D×H) physical dimension
1040×1080×1750mm
machine net weight
 850KG

Features of products

• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
2.4KW 60000rpm Wafer Cutting Machine For PCB
2.4KW 60000rpm Wafer Cutting Machine For PCB

Product Tags:

2.4KW Wafer Cutting Machine

      

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